TIF®600P Premium Soft Silicone Thermal Pad For AI Processors
The TIF®600P Series is a well-balanced,general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness . This balanced design provides both good surface conformity and excellent ease of use,making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between costand performance.
Features:
> Good thermal conductivity: 6.0W/mK
> Ultra soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance
> Available in varies thicknesses
> Broad range of hardnesses available
> Outstanding thermal performance
Applications
> AI Servers, Inverters, Telecom Devices
> Power tools
> Network communication products
> Electric vehicle batteries Computer CPU/GPU Cooling
> New energy vehicle power systems
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
| Typical Properties of TIF®600P Series |
| Property | Value | Test method |
| Color | Garnet | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Density(g/cm³) | 3.4 | ASTM D792 |
| Thickness Range(inch/mm) | 0.020~0.030 (0.50~0.75) | 0.040~0.200 (1.0~5.0) | ASTM D374 |
| Hardness | 60 Shore 00 | 45 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | *** |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | ＞4.2X1013 Ohm-meter | ASTM D257 |
| Flame rating | V-0 | UL 94 (E331100) |
| Thermal conductivity | 6.0 W/m-K | ASTM D5470 |
| 6.0 W/m-K | ISO22007 |
Product Specifications
Standard Thickness: 0.020"(0.50 mm)-0.20" (5.00 mm) with increments of 0.010 inch (0.25 mm).
Standard Size: 16"×16" (406 mm ×406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
Notes: FG (Fiberglass) provides enhanced strength,
suitable for materials with thicknesses of 0.010" to 0.020" (0.25mm to 0.50mm)
The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
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TIF600P Premium Soft Silicone Thermal Pad For AI Processors Images
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