TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling
Product descriptions
TlF100-06U series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features
> Good thermal conductivity 1.5W/mK
> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stress application
> Available in varies thickness
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
Application
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
> Heat pipe thermal solutions
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
| Typical Properties of TIF100-06U Series |
| Color | White | Visual |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** |
| Thickness range | 0.020"~0.200"(0.5mm~5.0mm) | ASTM D374 |
| Hardness | 27 (Shore 00) | ASTM 2240 |
| Specific Gravity | 2.2 g/cc | ASTM D297 |
| Continuos Use Temp(℃) | -40~200 | ****** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 3.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 |
| Thermal conductivity | 1.5 W/m-K | ASTM D5470 |
| Outgassing (TML) | 0.35% | ASTM E595 |
| Flame Rating | 94-V0 | UL E331100 |
Standard Thicknesses
0.020-inch to 0.200-inch (0.5mm to 5.0mm)
Product Sizes:
8" x 16"(203mm x406mm),Individual die cut shapesand and custom thickness can be supplied.
Please contact us for confirming
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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TIF100-06U Performance Thermal Pad With Highly Efficient Thermal Conductivity For CPU Cooling Images
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